NearStack Substrate for Communication Infrastructure
A direct two-chip solution that enables low-latency communication.
In the communications infrastructure industry, high-speed and low-latency data transmission is required. Particularly in systems where real-time performance is demanded, signal delays can directly impact performance and potentially lead to a decline in service quality. Therefore, optimizing signal paths and minimizing transmission loss becomes crucial. Our OCP-compliant NearStack Substrate connector addresses this challenge by directly outputting high-speed transmission signals from the chip without going through the PCB. 【Use Cases】 - High-speed network equipment - Communication within data centers - 5G/6G base station equipment 【Benefits of Implementation】 - Reduction of signal delay - Improvement of transmission performance - Overall acceleration of the system
- Company：レスター 本社
- Price：Other
